RIKEN Selects IBM’s Next-Generation Quantum System to be Integrated with the Supercomputer Fugaku

– The engagement will provide RIKEN and its collaborators with on-premises access to an IBM Quantum System Two
– The only quantum system to be co-located with Fugaku, intended to accelerate application development for quantum-centric supercomputing.

ARMONK, N.Y. , April 30, 2024 – Today, IBM (NYSE: IBM) has announced an agreement with RIKEN, a Japanese national research laboratory, to deploy IBM’s next-generation quantum computer architecture and best-performing quantum processor at the RIKEN Center for Computational Science in Kobe, Japan. It will be the only instance of a quantum computer co-located with the supercomputer Fugaku.

This agreement was executed as part of RIKEN’s existing project, supported by funding from the New Energy and Industrial Technology Development Organization (NEDO), an organization under Japan’s Ministry of Economy, Trade and Industry (METI)’s “Development of Integrated Utilization Technology for Quantum and Supercomputers” as part of the “Project for Research and Development of Enhanced Infrastructures for Post 5G Information and Communications Systems.” RIKEN has dedicated use of an IBM Quantum System Two architecture for the purpose of implementation of its project. Under the project RIKEN and its co-PI SoftBank Corp., with its collaborators, University of Tokyo, and Osaka University, aim to demonstrate the advantages of such hybrid computational platforms for deployment as services in the future post-5G era, based on the vision of advancing science and business in Japan.

In addition to the project, IBM will work to develop the software stack dedicated to generating and executing integrated quantum-classical workflows in a heterogeneous quantum-HPC hybrid computing environment. These new capabilities will be geared towards delivering improvements in algorithm quality and execution times.

IBM Quantum System Two, which will be deployed at RIKEN and integrated with Fugaku, includes IBM’s plans to introduce its next-generation quantum computing architecture, combining expandable cryogenic infrastructure, modular quantum control electronics, and advanced system software to deliver quantum computing services that work alongside traditional HPC services — the core elements of IBM’s vision of quantum-centric supercomputing.

At IBM Quantum Summit 2023, ‘IBM Quantum Heron’ was released as IBM’s best performing quantum processor to date, with newly built architecture offering up to five-fold improvement in error reduction.(Credit: Ryan Lavine for IBM)

Quantum-centric supercomputing emerges from integrated quantum and classical computing resources, working together in parallelized workloads, to run computations beyond what was possible before. Quantum-centric supercomputing is IBM’s vision of the future for traditional HPC, where quantum computing will be an integral part of the architecture. And IBM Quantum System Two constitutes a fundamental building block towards this architecture.

The system will be powered by a 133-qubit ‘IBM Quantum Heron’ processor. IBM Heron is the first in a new series of quantum processors with an architecture that delivers the highest performance metrics of any IBM Quantum processor that has been released, to date. Now available to users via the cloud, experiments on IBM Heron also had the lowest error rates of any IBM Quantum processor, offering a five-fold improvement over the previous best records set by IBM Eagle.

“Advanced quantum computers of NISQ are now moving into the practical stage as the number of qubits is increasing and the fidelity is improved. From the HPC’s point of view, quantum computers are devices that accelerate scientific applications conventionally executed on supercomputers and enable computations that cannot yet be solved by supercomputers. RIKEN is committed to developing system software for quantum-HPC hybrid computing, by leveraging its comprehensive scientific research capabilities and experience in the development and operation of cutting-edge supercomputers, such as Fugaku,” said Dr. Mitsuhisa Sato, Director, Quantum HPC Collaborative Platform Division, RIKEN Center for Computational Science.

“As the first quantum system that will directly connect with the Fugaku classical supercomputer, IBM’s agreement with RIKEN marks a monumental milestone in the journey towards a future defined by quantum-centric supercomputing,” said Jay Gambetta, IBM Fellow and Vice President, IBM Quantum. “This work will advance the industry towards a modular and flexible architecture that combines quantum computation and communication with classical computing resources, so that both paradigms can work together to solve increasingly complex problems.”

About IBM

IBM is a leading provider of global hybrid cloud and AI, and consulting expertise. We help clients in more than 175 countries capitalize on insights from their data, streamline business processes, reduce costs and gain the competitive edge in their industries. More than 4,000 government and corporate entities in critical infrastructure areas such as financial services, telecommunications and healthcare rely on IBM’s hybrid cloud platform and Red Hat OpenShift to affect their digital transformations quickly, efficiently and securely. IBM’s breakthrough innovations in AI, quantum computing, industry-specific cloud solutions and consulting deliver open and flexible options to our clients. All of this is backed by IBM’s long-standing commitment to trust, transparency, responsibility, inclusivity and service. Visit www.ibm.com for more information.

About RIKEN

RIKEN is Japan’s largest research institute for basic and applied research. Over 2500 papers by RIKEN researchers are published every year in leading scientific and technology journals covering a broad spectrum of disciplines including physics, chemistry, biology, engineering, and medical science. RIKEN’s research environment and strong emphasis on interdisciplinary collaboration and globalization has earned a worldwide reputation for scientific excellence.

IBM, Government of Canada, Government of Quebec Sign Agreements to Strengthen Canada’s Semiconductor Industry

BROMONT, QCApril 26, 2024 /PRNewswire/ — IBM (NYSE: IBM), the Government of Canada, and the Government of Quebec today announced agreements that will strengthen Canada’s semiconductor industry, and further develop the assembly, testing and packaging (ATP) capabilities for semiconductor modules to be used across a wide range of applications including telecommunications, high performance computing, automotive, aerospace & defence, computer networks, and generative AI, at IBM Canada’s plant in Bromont, Quebec. The agreements reflect a combined investment valued at approximately $187M CAD.

“Today’s announcement is a massive win for Canada and our dynamic tech sector. It will create high-paying jobs, invest in innovation, strengthen supply chains, and help make sure the most advanced technologies are Canadian-made. Semiconductors power the world, and we’re putting Canada at the forefront of that opportunity,” said the Right Honourable Justin Trudeau, Prime Minister of Canada.

The IBM Canada plant in Bromont, Quebec is one of North America’s largest chip assembly and testing facilities. IBM Canada, the Government of Canada, and the Government of Quebec have announced agreements reflecting a combined investment valued at approximately $187M that will strengthen Canada’s semiconductor industry and advance R&D at the IBM facility.

In addition to the advancement of packaging capabilities, IBM will be conducting R&D to develop methods for scalable manufacturing and other advanced assembly processes to support the packaging of different chip technologies, to further Canada’s role in the North American semiconductor supply chain and expand and anchor Canada’s capabilities in advanced packaging.

The agreements also allow for collaborations with small and medium-sized Canadian-based enterprises with the intent of fostering the development of a semiconductor ecosystem, now and into the future.

“IBM has long been a leader in semiconductor research and development, pioneering breakthroughs to meet tomorrow’s challenges. With the demand for compute surging in the age of AI, advanced packaging and chiplet technology is becoming critical for the acceleration of AI workloads,” said Darío Gil, IBM Senior Vice President and Director of Research. “As one of the largest chip assembly and testing facilities in North America, IBM’s Bromont facility will play a central role in this future. We are proud to be working with the governments of Canada and Quebec toward those goals and to build a stronger and more balanced semiconductor ecosystem in North America and beyond.”

IBM Canada’s Bromont plant is one of North America’s largest chip assembly and testing facilities, having operated in the region for 52 years. Today, the facility transforms advanced semiconductor components into state-of-the-art microelectronic solutions, playing a key role in IBM’s semiconductor R&D leadership alongside IBM’s facilities at the Albany NanoTech Complex and throughout New York’s Hudson Valley. These agreements will help to further establish a corridor of semiconductor innovation from New York to Bromont.

“Advanced packaging is a crucial component of the semiconductor industry, and IBM Canada’s Bromont plant has led the world in this process for decades,” said Deb Pimentel, president of IBM Canada. “Building upon IBM’s 107-year legacy of technology innovation and R&D in Canada, the Canadian semiconductor industry will now become even stronger, allowing for robust supply chains and giving Canadians steady access to even more innovative technologies and products. This announcement represents just one more example of IBM’s leadership and commitment to the country’s technology and business landscape.”

Chip packaging, the process of connecting integrated circuits on a chip or circuit board, has become more complex as electronic devices have shrunk and the components of chips themselves get smaller and smaller. IBM announced the world’s first 2 nanometer chip technology in 2021 and, as the semiconductor industry moves towards new methods of chip construction, advances in packaging will grow in importance.

“Semiconductors are part of our everyday life. They are in our phones, our cars, and our appliances. Through this investment, we are supporting Canadian innovators, creating good jobs, and solidifying Canada’s semiconductor industry to build a stronger economy. Canada is set to play a larger role in the global semiconductor industry thanks to projects like the one we are announcing today. Because, when we invest in semiconductor and quantum technologies, we invest in economic security.”  — The Honourable François-Philippe Champagne, Minister of Innovation, Science and Industry

“This investment by IBM in Bromont will ensure that Quebec continues to stand out in the field of microelectronics. An increase in production capacity will solidify Quebec’s position in the strategic microelectronics sector in North America.” — The Honourable Pierre Fitzgibbon, Minister of Economy, Innovation and Energy, Minister responsible for Regional Economic Development and Minister responsible for the Metropolis and the Montreal region